Enterprise Systems · 2027 Roadmap
1U, 2U & 3U High-Density Blade Servers.
Turnkey enterprise rack systems powered by Stallion GPUs and Gallium HBM4 memory, delivering up to 131 TB/s aggregate memory bandwidth with direct-to-chip liquid cooling and CXL 3.1 pooling.
Form Factors
Turnkey AI Supercomputing Chassis.
FAIRVIEW SYSTEMS · FV-RACK-1U · 1U RACK-MOUNT BLADE CHASSIS
2027 DeliverySTORAGE & I/O MATRIX
UNIFIED GPU + HBM4 COMPUTE MATRIX
ACCELERATOR NODE 1STALLION + GALLIUMHBM4 UNIFIED PLANE
ACCELERATOR NODE 2STALLION + GALLIUMHBM4 UNIFIED PLANE
ACCELERATOR NODE 3STALLION + GALLIUMHBM4 UNIFIED PLANE
ACCELERATOR NODE 4STALLION + GALLIUMHBM4 UNIFIED PLANE
CXL 3.1 / PCIe Gen6 Fabric800GbE OSFP NetworkingDIRECT-TO-CHIP LIQUID COOLING
Compute Density4x Stallion S80I or 2x Stallion S100 ModulesHigh-Efficiency Tensor Engine
Unified HBM4 Memory576 GB Unified HBM432.768 TB/s Aggregate
Interconnect & FabricDual PCIe Gen6 x16 + CXL 3.1 Memory PoolingDual 800GbE OSFP (RDMA / RoCEv2)
Thermal Efficiency1,800W Peak / Redundant 80-Plus TitaniumDirect-to-Chip Liquid or High-Static Air
System Matrix
Comparative Blade Specifications.
| Feature | FV-RACK-1U | FV-RACK-2U | FV-RACK-3U |
|---|---|---|---|
| Target Role | High-Density Inference | Enterprise Training | Megascale Pre-Training |
| Compute Nodes | 4x Accelerator Nodes | 8x Accelerator Nodes | 16x Hybrid Compute Nodes |
| Unified HBM4 Capacity | 576 GB | 1,152 GB (1.15 TB) | 2,304 GB (2.30 TB) |
| Memory Bandwidth | 32.768 TB/s | 65.536 TB/s | 131.072 TB/s |
| Host Fabric | Dual PCIe 6 + CXL 3.1 | Quad PCIe 6 + CXL 3.1 | Octal PCIe 6 + CXL 3.1 |
| Networking | Dual 800GbE OSFP | Quad 800GbE OSFP | Octal 800GbE OSFP |
| Thermal Solution | High-Static Air | Direct Liquid Cooling | Full Liquid Immersion |
| Delivery Target | 2027 Delivery Book | 2027 Delivery Book | 2027 Delivery Book |